High purity Sputtering Metal target Copper Cu target special-shaped customization manufacturer from China

     We Can Produce Copper Targets Of Various Purity And Requirements With A Purity Of 99.9%~99.9999%. The Oxygen Content Can Be As Low As <1ppm. It Is Mainly Used For Display Screens And Touch Screen Wiring And Protective Films, Solar Light Absorption Layers, And Semiconductors. Wiring And Other Industries. In Addition To Meeting The Needs Of Customers For Flat Targets (The Largest G8.5 Generation), We Can Also Produce Copper Rotating Targets, Which Are Mainly Used In The Touch Screen Industry. 

    The Crystal Grains Of High-Purity Copper Targets Are Difficult To Break. We Can Only Control The Growth Of Crystals Through Ultra-Large Deformation Processing To Obtain A Fine And Uniform Microstructure , Which Can Ensure A Lower Erosion Rate During Sputtering Coating, And Reduce The Sensitivity Of Particle Formation During Sputtering. The Following Figure Shows Two Typical Microscopic Metallographic Inspection Pictures Of Copper Sputtering Targets, With An Average Particle Size <50um.

     As long as you provide detailed target information, such as purity, size, tolerance requirements, and other technical requirements, we will provide you with a quotation as soon as possible and provide the fastest delivery time.

     Impurities In The Copper Sputtering Target Will Reduce The Conductivity Of The Material, And Impurity Elements Are The Main Factor Affecting The Yield In The Production Of Semiconductor Films. Impurities In The Form Of Titanium, Phosphorous, Calcium, Iron, Chromium And Selenium Are Particularly Critical. These Metals Are Very Low In Our Copper Targets, And Their Impurity Content Is Far Below The Standard Value Required By Customers. The Following Table Is The Composition Analysis Certificate Of The 4N High-Purity Copper Sputtering Target. The Analysis Methods Used Are: 1. Use GDMS Or ICP-OES To Analyze Metal Elements; 2. Use LECO For Gas Element Analysis.