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GS-T008Payment:
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Tantalum target material, tantalum chemical symbol Ta, steel gray metal, belongs to VB group in the periodic table, atomic number 73, atomic weight 180.9479, body-centered cubic crystal, common valence is +5. The hardness of tantalum is relatively low and is related to the oxygen content. For ordinary pure tantalum, the Vickers hardness in the annealed state is only 140HV. Its melting point is as high as 2995°C, which ranks fifth after carbon, tungsten, rhenium and osmium among simple substances.
Tantalum is malleable and can be drawn into thin filaments to make thin foils. Its thermal expansion coefficient is very small. Every one degree Celsius rises only 6.6 parts per million. In addition, its toughness is very strong, even better than copper. High-purity tantalum can be used as solid electrolytic capacitors with large capacity, small size and stable performance. It can be used in radars, missiles, supersonic aircraft and electronic computers. Tantalum can also be used to make petrochemical heat exchangers, heaters, concentrators and reactions. Tanks, towers, pipes, valves, etc. Tantalum can also be used as a material for electron launch tubes and high-power electronic tube parts. Tantalum alloys can be used as supersonic aircraft combustion chambers and heat-resistant and high-strength materials. Tantalum-tungsten alloy missile nozzles.
Tantalum carbide can be used alone or together with other carbon compounds. For forging dies, cutting tools, jet engine turbine blades, valves and rocket nozzle coatings. Tantalum carbide is widely used in the manufacture of cemented carbide. Tantalum also has stability and healing properties with human tissues, and can be used as a surgical replenishment material and artificial bone, as well as bone plates, screws and suture needles. The picture below is a microscopic metallographic inspection picture of a tantalum sputtering target, the average particle size is less than 100um.
As long as you provide detailed target information, such as purity, size, tolerance requirements, and other technical requirements, we will provide you with a quotation as soon as possible and provide the fastest delivery time.
We produce high-purity sputtering targets. Its most important advantage is that in the process of physical vapor deposition, a thin film with excellent conductivity and particle minimization can be obtained. The following table is a certificate of composition analysis of 3N5 high-purity tantalum sputtering target. The analytical methods used: 1. Use ICP-OES to analyze metal elements; 2. Use LECO to analyze gas elements.