Item NO.:
GS-C072Payment:
L/C、 Western Union、 D/P、 T/TProduct Origin:
Anhui, ChinaMax Size:
customizedOrientation:
Package:
100 clean bag,1000 exactly clean bagProduct Detail
Specification
Process flow
Packaging
Transportation
FAQ
Silicon nitride (Si3N4 ) ceramics substrate
Molecular formula
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Si 3 N 4
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Relative molecular mass
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140.28
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colour
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Gray, gray black
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Crystal system
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Hexagonal crystal system. Hexahedron
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Ceramic chip preparation method
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Hot pressing
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Relative density
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99.5%
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density
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3.2+/-0.02 g/cm 3
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Moh's hardness
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9~9.5
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Melting point
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1900°C (under pressure). Usually decomposes at 1900℃ under normal pressure
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Thermal expansion coefficient
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2.8~3.2×10 -6 /℃(20~1000℃)
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Specific heat capacity
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0.71J/(g·K)
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Thermal conductivity
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15~ 20W/(m·K)
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Elastic Modulus
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300~320 GPa
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Fracture toughness
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6.0~7.0 MPa.m
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Bending strength
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650~750 Mpa
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Weber modulus
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10~12
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Solubility
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Insoluble in water. Soluble in hydrofluoric acid.
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Oxidation temperature
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The temperature at which oxidation starts in the air is 1300~1400℃
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